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| (R) EMIF04-10006F2 IPADTM 4 LINES EMI FILTER AND ESD PROTECTION MAIN PRODUCT CHARACTERISTICS Where EMI filtering in ESD sensitive equipment is required: Mobile phones and communication systems Computers, printers and MCU Boards DESCRIPTION The EMIF04-10006F2 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF04 flip-chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. This device includes four EMIF filters and 4 separated ESD diodes. BENEFITS EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free package Very low PCB space consuming: 2.92mm x 1.29mm Very thin package: 0.65 mm High efficiency in ESD suppression (IEC61000-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging. COMPLIES WITH THE FOLLOWING STANDARDS: IEC 61000-4-2 level 4: 15kV (air discharge) 8kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3: 30kV (R) Flip-Chip (15 Bumps) Table 1: Order Code Part Number EMIF04-10006F2 Marking FS Figure 1: Pin Configuration (ball side) 9 8 7 6 5 4 3 2 1 D3 Gnd D4 I4 I3 Gnd O3 I2 I1 Gnd D1 A B O4 O2 O1 D2 C TM: IPAD is a trademark of STMicroelectronics. September 2004 REV. 1 1/7 EMIF04-10006F2 Figure 2: Basic Cell Configuration 100 100 Input 1 30pF 30pF Output 1 Input 4 30pF 30pF Output 4 100 Input 2 30pF 30pF Output 2 D1 30pF 30pF D2 100 Input 3 30pF 30pF Output 3 D3 30pF 30pF D4 Table 2: Absolute Ratings (limiting values) Symbol Parameter and test conditions PR DC power per resistance PT Tj Top Tstg Total DC power per package Maximum junction temperature Operating temperature range Storage temperature range Value 0.1 0.6 125 - 40 to + 85 125 Unit W W C C C Table 3: Electrical Characteristics (Tamb = 25 C) Symbol Parameter VBR Breakdown voltage IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input and output Capacitance per line Test conditions IR = 1 mA VRM = 3.3 V per line I = 10 mA VR = 2.5 V, F = 1 MHz, 30 mV (on filter cells) 80 50 Min. 5.5 I IF VF VCL VBR VRM IRM IR V IPP Typ. 7 100 60 Max. 9 500 120 70 Unit V nA pF 2/7 EMIF04-10006F2 Figure 3: S21 (dB) attenuation measurements and Aplac simulation 0.00 dB -12.50 Figure 4: Analog crosstalk measurements Aplac 7.62 User: ST Microelectronics 00 dB -25 i3_o2.s2p -25.00 -50 -37.50 -75 Measurement Simulation f/Hz -50.00 100.0k -100 1.0M 10.0M 100.0M 1.0G f/Hz 100k 1M 10M 100M 1G Figure 5: Digital crosstalk measurements Figure 6: ESD response to IEC61000-4-2 (+15kV air discharge) on one imput V(in) and one output V(out) Figure 7: ESD response to IEC61000-4-2 (-15kV air discharge) on one imput V(in) and one output V(out) Figure 8: Line capacitance versus applied voltage for filter C(pF) 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 F=1MHz Vosc=30mVRMS Tj=25C VR(V) 3/7 EMIF04-10006F2 Figure 9: Aplac model Rbump Ii* Lbump Rs=100 Lbump Rbump Oi* sub Cz=41pF@0V Cbump Rsub Cz=41pF@0V Rsub Cbump Rsub Rbump Oi * = Output of each filter cell Ii* = Input of each filter cell sub Lbump Rbump Dj * Lbump Lbump Rbump Di* Cgnd Lgnd Cz=41pF@0V Cbump Rsub With Dj* = D1 & D3 And Di* = D2 & D4 Cz=41pF@0V Rsub Cbump Rgnd sub EMIF04-10006F2 model Ground return for each GND bump Figure 10: Aplac parameters aplacvar RS aplacvar Cz aplacvar Lbump aplacvar Rbump aplacvar Cbump aplacvar Rsub aplacvar Rgnd aplacvar Lgnd aplacvar Cgnd 100 41 pF 50 pH 20 m 1.2 pF 100 m 100 m 100 pH 0.15 pF 4/7 EMIF04-10006F2 Figure 11: Order code EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500m, Bump = 315m = 2: Leadfree Pitch = 500m, Bump = 315m yy - xxx zz Fx Figure 12: FLIP-CHIP Package Mechanical Data 315m 50 500m 50 250m 50 435m 50 650m 65 50 1 m 5 2.92mm 50m Figure 13: Foot print recommendations Figure 14: Marking 400 1.29mm 50m 0 Copper pad Diameter : 250m recommended , 300m max Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) 545 545 E Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 300m copper pad diameter xxz yww 100 230 All dimensions in m 5/7 EMIF04-10006F2 Figure 15: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm Table 4: Ordering Information Ordering code EMIF04-10006F2 Marking FS Package Flip-Chip Weight 5.4 mg Base qty 5000 Delivery mode Tape & reel 7" Note: More packing informations are available in the application note AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" Table 5: Revision History Date 08-Sep-2004 6/7 8 +/- 0.3 STE First issue STE STE Revision 1 xxz yww User direction of unreeling xxz yww xxz yww 4 +/- 0.1 Description of Changes EMIF04-10006F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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